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P‐66: Low Coefficient of Thermal Expansion (CTE) Display Glass Minimizes Chip on Glass (COG) Light Leakage (LL) from Chip Warp.
- Source :
- SID Symposium Digest of Technical Papers; Jun2019, Vol. 50 Issue 1, p1481-1484, 4p
- Publication Year :
- 2019
-
Abstract
- Based on application of heated bi‐metal strip bending theory to measured chip warp on 0.5 mm thick bare Corning® EAGLEXG® Glass and Corning Lotus™ NXT Glass, low substrate CTE minimizes chip warp. Different substrates have different effective process temperatures. Chip warp is relatively insensitive to substrate Young's modulus vs. substrate CTE. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 0097966X
- Volume :
- 50
- Issue :
- 1
- Database :
- Complementary Index
- Journal :
- SID Symposium Digest of Technical Papers
- Publication Type :
- Academic Journal
- Accession number :
- 136710603
- Full Text :
- https://doi.org/10.1002/sdtp.13221