P‐66: Low Coefficient of Thermal Expansion (CTE) Display Glass Minimizes Chip on Glass (COG) Light Leakage (LL) from Chip Warp.

Based on application of heated bi‐metal strip bending theory to measured chip warp on 0.5 mm thick bare Corning® EAGLEXG® Glass and Corning Lotus™ NXT Glass, low substrate CTE minimizes chip warp. Different substrates have different effective process temperatures. Chip warp is relatively insensitive to substrate Young's modulus vs. substrate CTE. [ABSTRACT FROM AUTHOR]