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Magnetomechanical model for coating/substrate interface and its application in interfacial crack propagation length characterization.

Authors :
Qian, Zhengchun
Huang, Haihong
Liu, Wenjie
Zhao, Lunwu
Han, Gang
Source :
Journal of Applied Physics; 2018, Vol. 124 Issue 20, pN.PAG-N.PAG, 9p, 5 Diagrams, 8 Graphs
Publication Year :
2018

Abstract

During the service process of remanufactured components, the stress and crack may occur at the interface between coating and substrate due to their mechanical property mismatch. Based on the spontaneous magnetization phenomenon in ferromagnetic materials, the stress distribution and crack propagation length along the interface can be characterized. In this paper, the magnetomechanical constitutive model for interface is established according to Timoshenko beam theory and Jiles' stress-magnetization model. The distributions of stress and residual magnetization along the interface are analyzed under the effect of typical three-point bending (TPB) load. The results show that the interfacial residual magnetization M<subscript>r</subscript> can reflect the stress distribution very well and its peak value at supporting seat M<subscript>r</subscript><subscript>3</subscript> is closely related to interfacial crack propagation length. In order to verify the theoretical model, the metal magnetic memory (MMM) technique is used to collect the residual magnetic field along the interface in the TPB testing. The experimental results are consistent with the theoretical predictions. They indicate that the magnetomechanical model for coating/substrate interface established in this paper can provide the theoretical support for magnetic non-destructive testing and the calculation results can be applied to the interfacial crack propagation length characterization in MMM. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
00218979
Volume :
124
Issue :
20
Database :
Complementary Index
Journal :
Journal of Applied Physics
Publication Type :
Academic Journal
Accession number :
133317995
Full Text :
https://doi.org/10.1063/1.5054193