Analytical Elastic-Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer.

Details

Language :

English

ISSN :

10871357

Volume :

140

Issue :

12

Database :

Complementary Index

Journal :

Journal of Manufacturing Science & Engineering

Publication Type :

Academic Journal

Accession number :

133037733

Full Text :

https://doi.org/10.1115/1.4041245