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Microstructure, interfacial reactions and mechanical properties of Co/Sn/Co and Cu/Sn/Cu joints produced by transient liquid phase bonding.
- Source :
- Journal of Materials Science: Materials in Electronics; Oct2018, Vol. 29 Issue 19, p16388-16400, 13p
- Publication Year :
- 2018
-
Abstract
- In this paper, the wettability and growth behaviors of interfacial intermetallic compounds (IMCs) in the Sn/Co and Sn/Cu liquid/solid couples were comparatively investigated. In situ tensile tests were conducted to evaluate the mechanical properties of the Co/Sn(IMCs)/Co and Cu/Sn(IMCs)/Cu joints. The wettability of Sn on Cu substrate was better than that of Co substrate. The lath-like CoSn<subscript>3</subscript> IMCs limited the improvement of wettability of Sn on Co substrate, even if the soldering temperature was increased. The Sn/Co couples showed an acceptable wettability for electronic application. During liquid aging, the rapid growing interfacial CoSn<subscript>3</subscript> were controlled by the combination of chemical reaction and atomic diffusion. Grain boundary diffusion should be responsible for the growth of Cu<subscript>6</subscript>Sn<subscript>5</subscript> in the Sn/Cu liquid/solid couples. The tensile strength and elongation of the Co/CoSn<subscript>3</subscript>/Co joints were basically equal to that of the Cu/IMCs/Cu full IMCs joints. Interfacial IMCs cracks were more likely to occur in the joints fabricated by Co substrate. The Co/CoSn<subscript>3</subscript>/Co sandwich structure can be fabricated within a remarkable short period of time at low temperature without pressure. [ABSTRACT FROM AUTHOR]
- Subjects :
- MICROSTRUCTURE
COPPER
SOLDER & soldering
METALS
MICROPHYSICS
Subjects
Details
- Language :
- English
- ISSN :
- 09574522
- Volume :
- 29
- Issue :
- 19
- Database :
- Complementary Index
- Journal :
- Journal of Materials Science: Materials in Electronics
- Publication Type :
- Academic Journal
- Accession number :
- 131780067
- Full Text :
- https://doi.org/10.1007/s10854-018-9730-8