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Towards Miniaturization of Electronics by Developing and Characterizing Hyperfine Solder Powders used in Printed Circuit Boards.

Authors :
Exarchos, D. A.
Dalla, P. T.
Tzetzis, D.
Karantzalis, A. E.
Bochtis, D.
Matikas, T. E.
Source :
Proceedings of SPIE; 1/29/2018, Vol. 10601, p1-6, 6p
Publication Year :
2018

Details

Language :
English
ISSN :
0277786X
Volume :
10601
Database :
Complementary Index
Journal :
Proceedings of SPIE
Publication Type :
Conference
Accession number :
130347634
Full Text :
https://doi.org/10.1117/12.2323279
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