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A Fully Integrated Quartz MEMS VHF TCXO.

Authors :
Kubena, Randall L.
Stratton, Frederic P.
Nguyen, Hung D.
Kirby, Deborah J.
Chang, David T.
Joyce, Richard J.
Yong, Yook-Kong
Garstecki, Jeffrey F.
Cross, Matthew D.
Seman, S. E.
Source :
IEEE Transactions on Ultrasonics Ferroelectrics & Frequency Control; Jun2018, Vol. 65 Issue 6, p904-910, 7p
Publication Year :
2018

Abstract

We report on a 32-MHz quartz temperature compensated crystal oscillator (TCXO) fully integrated with commercial CMOS electronics and vacuum packaged at wafer level using a low-temperature MEMS-after quartz process. The novel quartz resonator design provides for stress isolation from the CMOS substrate, thereby yielding classical AT-cut f/T profiles and low hysteresis which can be compensated to < ±0.2 parts per million over temperature using on-chip third-order compensation circuitry. The TCXO operates at low power of 2.5 mW and can be thinned to $\le 300~\mu \text{m}$ as part of the wafer-level eutectic encapsulation. Full integration with large state-of-the-art CMOS wafers is possible using carrier wafer techniques. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
08853010
Volume :
65
Issue :
6
Database :
Complementary Index
Journal :
IEEE Transactions on Ultrasonics Ferroelectrics & Frequency Control
Publication Type :
Academic Journal
Accession number :
129915127
Full Text :
https://doi.org/10.1109/TUFFC.2017.2786248