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A Design Optimization Tool for Maximizing the Power Density of 3-Phase DC?AC Converters Using Silicon Carbide (SiC) Devices.
- Source :
- IEEE Transactions on Power Electronics; Apr2018, Vol. 33 Issue 4, p2913-2932, 20p
- Publication Year :
- 2018
-
Abstract
- The emergence of wide-bandgap devices, e.g., silicon carbide (SiC), has the potential to enable very high-density power converter design with high-switching frequency operation capability. A comprehensive design tool with a holistic design approach is critical to maximize the overall system power density, e.g, by identifying the optimal switching frequency. This paper presents a system level design tool that optimizes the power density (volume or mass) of a three-phase, two-level dc–ac converter. The design tool optimizes the selection of the devices, heatsink and passive components (including the design of the line, electromagnetic interference (EMI), and dc-link filters) to maximize the power density. The structure of the optimization algorithm has been organized to reduce the number of potential design combinations by over 99%, and thus, produces fast simulation times. The design tool predicts that when SiC devices are used instead of Si ones, the power density is increased by 159.4%. A 5 kW, 600-V dc-link, three-phase, two-level dc–ac converter was experimentally evaluated in order to confirm the accuracy of the design tool. [ABSTRACT FROM PUBLISHER]
Details
- Language :
- English
- ISSN :
- 08858993
- Volume :
- 33
- Issue :
- 4
- Database :
- Complementary Index
- Journal :
- IEEE Transactions on Power Electronics
- Publication Type :
- Academic Journal
- Accession number :
- 127252450
- Full Text :
- https://doi.org/10.1109/TPEL.2017.2705805