P-210: Investigation on the Reliability of OGS Thermoplastic ACF.

In this paper, the reliability of thermoplastic ACF in the process of OGS touch panel manufacturing was studied. The fourier transform infrared spectroscopy (FTIR), volume removal gel permeation chromatography (GPC) and weighing method research were used to characterize the structure of functional group, molecular weight and the change of absorption rate of ACF colloid materials under different curing condition. The thermal decomposition temperature and glass transition temperature were characterized by thermo gravimetric and differential thermal (TG-DSC) analysis. The effect of high temperature and high humidity on the bond strength of ACF was studied by the failure test of adhesion mode. The results showed that, under high temperature and high humidity environment, because of the erosion of water molecules, the plasticity of ACF materials became stronger, the glass transition temperature (Tg) decreased and the thermal stability became worse. As a result, the bond strength of the material was greatly influenced by the humidity. In addition, the comparison of different aging time pull out force test after the thermoplastic ACF sample scanning electron microscope (SEM) images could be indicated that the peeling effect of ACF with damp heat aging time was more and more obvious. [ABSTRACT FROM AUTHOR]