Die and Package Level Thermal and Thermal/Moisture Stresses in 3D Packaging: Modeling and Characterization.

Details

Language :

English

ISBNs :

9783319445847

Database :

Complementary Index

Journal :

3D Microelectronic Packaging

Publication Type :

Book

Accession number :

122108574

Full Text :

https://doi.org/10.1007/978-3-319-44586-1_12