Cite
Nonrectangular Shaping and Sizing of Soft Modules for Floorplan-Design Improvement.
MLA
Chu, Chris C. N., and Evangeline F. Y. Young. “Nonrectangular Shaping and Sizing of Soft Modules for Floorplan-Design Improvement.” IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems, vol. 23, no. 1, Jan. 2004, pp. 71–79. EBSCOhost, https://doi.org/10.1109/TCAD.2003.819896.
APA
Chu, C. C. N., & Young, E. F. Y. (2004). Nonrectangular Shaping and Sizing of Soft Modules for Floorplan-Design Improvement. IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems, 23(1), 71–79. https://doi.org/10.1109/TCAD.2003.819896
Chicago
Chu, Chris C. N., and Evangeline F. Y. Young. 2004. “Nonrectangular Shaping and Sizing of Soft Modules for Floorplan-Design Improvement.” IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems 23 (1): 71–79. doi:10.1109/TCAD.2003.819896.