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Effect of electroless Ni-P thickness on EFTECH 64-Ni, EFTECH 64-Cu and C194-Ni bump.

Authors :
Ong, Cheng-Guan
Lau, Kok-Tee
Zaimi, Muhammad
Afiq, Muhammad
Queck, Kian-Pin
Source :
2016 11th International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT); 2016, p319-322, 4p
Publication Year :
2016

Details

Language :
English
ISBNs :
9781509047697
Database :
Complementary Index
Journal :
2016 11th International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT)
Publication Type :
Conference
Accession number :
120854207
Full Text :
https://doi.org/10.1109/IMPACT.2016.7799982
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