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Prediction of multilayer printed wiring board temperatures during lamination.
- Source :
- 1973 EIC 11th Electrical Insulation Conference; 1973, p211-214, 4p
- Publication Year :
- 1973
Details
- Language :
- English
- ISBNs :
- 9781509031108
- Database :
- Complementary Index
- Journal :
- 1973 EIC 11th Electrical Insulation Conference
- Publication Type :
- Conference
- Accession number :
- 116437063
- Full Text :
- https://doi.org/10.1109/EIC.1973.7468689