High speed encapsulation using liquid injection molding with thermosetting silicone elastomers.

Details

Language :

English

ISBNs :

9781509031160

Database :

Complementary Index

Journal :

1971 EIC 10th Electrical Insulation Conference

Publication Type :

Conference

Accession number :

116436903

Full Text :

https://doi.org/10.1109/EIC.1971.7460776