Principles and applications of trans-wafer processing using a 2-μm thulium fiber laser.

MLA

Mingareev, Ilya, et al. “Principles and Applications of Trans-Wafer Processing Using a 2-Μm Thulium Fiber Laser.” International Journal of Advanced Manufacturing Technology, vol. 84, no. 9–12, June 2016, pp. 2567–78. EBSCOhost, https://doi.org/10.1007/s00170-015-7870-z.

APA

Mingareev, I., Gehlich, N., Bonhoff, T., Abdulfattah, A., Sincore, A., Kadwani, P., Shah, L., & Richardson, M. (2016). Principles and applications of trans-wafer processing using a 2-μm thulium fiber laser. International Journal of Advanced Manufacturing Technology, 84(9–12), 2567–2578. https://doi.org/10.1007/s00170-015-7870-z

Chicago

Mingareev, Ilya, Nils Gehlich, Tobias Bonhoff, Ali Abdulfattah, Alex Sincore, Pankaj Kadwani, Lawrence Shah, and Martin Richardson. 2016. “Principles and Applications of Trans-Wafer Processing Using a 2-Μm Thulium Fiber Laser.” International Journal of Advanced Manufacturing Technology 84 (9–12): 2567–78. doi:10.1007/s00170-015-7870-z.