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Characterization of pressure-less Ag sintering on Ni/Au surface.
- Source :
- 2015 IEEE 17th Electronics Packaging & Technology Conference (EPTC); 1/1/2015, p1-4, 4p
- Publication Year :
- 2015
Details
- Language :
- English
- ISBNs :
- 9781467372695
- Database :
- Complementary Index
- Journal :
- 2015 IEEE 17th Electronics Packaging & Technology Conference (EPTC)
- Publication Type :
- Conference
- Accession number :
- 114286495
- Full Text :
- https://doi.org/10.1109/EPTC.2015.7412369