HIPIMS in full face erosion circular cathode for semiconductor applications.

Authors :: Bellido-Gonzalez, V.
Papa, F.
Azzopardi, A.
Brindley, J.
Li, H.
Vetushka, A.
Kroehnert, K.
Ehrmann, O.
Lang, K-D.
Mackowiak, P.
Fernandez, I.
Wennberg, A.
Ngo, H. D.
Source :: 2015 IEEE 17th Electronics Packaging & Technology Conference (EPTC); 1/1/2015, p1-5, 5p
Publication Year :: 2015

Language :: English
ISBNs :: 9781467372695
Database :: Complementary Index
Journal :: 2015 IEEE 17th Electronics Packaging & Technology Conference (EPTC)
Publication Type :: Conference
Accession number :: 114286389
Full Text :: https://doi.org/10.1109/EPTC.2015.7412263