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Investigation of fracture mechanisms and bond-line of insert bump bonding specimens.
- Source :
- 2015 European Microelectronics Packaging Conference (EMPC); 2015, p1-4, 4p
- Publication Year :
- 2015
Details
- Language :
- English
- ISBNs :
- 9780956808622
- Database :
- Complementary Index
- Journal :
- 2015 European Microelectronics Packaging Conference (EMPC)
- Publication Type :
- Conference
- Accession number :
- 112876848