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MoSi2-type narrow band gap intermetallic compound Al6Re5Si4 as a thermoelectric material.

Authors :
Takagiwa, Y.
Utada, S.
Kanazawa, I.
Kimura, K.
Source :
Journal of Materials Chemistry C; 10/28/2015, Vol. 3 Issue 40, p10422-10429, 8p
Publication Year :
2015

Abstract

The thermoelectric properties of MoSi<subscript>2</subscript>-type intermetallic compound Al<subscript>6</subscript>Re<subscript>5</subscript>Si<subscript>4</subscript> (investigated compositions: Al<subscript>6−x</subscript>Re<subscript>4.7</subscript>Si<subscript>4+x</subscript> (x = 0–0.9)) related to TiSi<subscript>2</subscript>-type narrow band gap intermetallic compounds were systematically investigated. A first-principles band structure calculation implies that this compound forms a narrow band gap in the electronic density of states that will be suitable for obtaining a large power factor. Indeed, the maximum power factor is 1.65 mW m<superscript>−1</superscript> K<superscript>−2</superscript> for the sample with x = 0.8. The Al<subscript>6−x</subscript>Re<subscript>4.7</subscript>Si<subscript>4+x</subscript> (x = 0–0.8) samples show degenerate semiconductor behavior as p-type materials; the temperature coefficient of the electrical conductivity is negative and the positive Seebeck coefficient increases with increasing temperature. A negative Seebeck coefficient is observed in the Si-rich sample with x = 0.9, which is understood by shifting the Fermi level to the conduction band. The estimated band gap is 0.53 eV from the Arrhenius plot. Because of a simple crystal structure, a relatively high thermal conductivity ranging from 7.6 to 13.5 W m<superscript>−1</superscript> K<superscript>−1</superscript> is observed at 300 K. The maximum dimensionless figure-of-merit of 0.19 at 973 K is close to the optimal value predicted by a single parabolic band model. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
20507526
Volume :
3
Issue :
40
Database :
Complementary Index
Journal :
Journal of Materials Chemistry C
Publication Type :
Academic Journal
Accession number :
110244548
Full Text :
https://doi.org/10.1039/c5tc01608h