Stacking integration methodologies in 3D IC for 3D ultrasound image processing application: A stochastic flash ADC design case study.

Details

Language :

English

ISBNs :

9781479983919

Database :

Complementary Index

Journal :

2015 IEEE International Symposium on Circuits & Systems (ISCAS)

Publication Type :

Conference

Accession number :

110062279

Full Text :

https://doi.org/10.1109/ISCAS.2015.7168871