A quantitative investigation of the influence with the components of the CMP alkali slurry on the polishing rate.

MLA

Fan Shiyan, et al. “A Quantitative Investigation of the Influence with the Components of the CMP Alkali Slurry on the Polishing Rate.” Journal of Semiconductors, vol. 36, no. 9, Sept. 2015, p. 1. EBSCOhost, https://doi.org/10.1088/1674-4926/36/9/096001.

APA

Fan Shiyan, Liu Enhai, Zhang Jun, Liu Yuling, Wang Lei, Lin Kai, Sun Ming, & Shi Lukui. (2015). A quantitative investigation of the influence with the components of the CMP alkali slurry on the polishing rate. Journal of Semiconductors, 36(9), 1. https://doi.org/10.1088/1674-4926/36/9/096001

Chicago

Fan Shiyan, Liu Enhai, Zhang Jun, Liu Yuling, Wang Lei, Lin Kai, Sun Ming, and Shi Lukui. 2015. “A Quantitative Investigation of the Influence with the Components of the CMP Alkali Slurry on the Polishing Rate.” Journal of Semiconductors 36 (9): 1. doi:10.1088/1674-4926/36/9/096001.