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High-throughput multiple dies-to-wafer (D2W) bonding for III/V-on-Si hybrid lasers.
- Source :
- 2015 Optical Fiber Communications Conference & Exhibition (OFC); 2015, p1-3, 3p
- Publication Year :
- 2015
Details
- Language :
- English
- ISBNs :
- 9781557529374
- Database :
- Complementary Index
- Journal :
- 2015 Optical Fiber Communications Conference & Exhibition (OFC)
- Publication Type :
- Conference
- Accession number :
- 108578430