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Monolithically series-interconnected GaInAsSb/AlGaAsSb/GaSb thermophotovoltaic devices with an internal backsurface reflector formed by wafer bonding.
- Source :
- Applied Physics Letters; 8/18/2003, Vol. 83 Issue 7, p1286, 3p, 1 Diagram, 3 Graphs
- Publication Year :
- 2003
-
Abstract
- GaInAsSb/AlGaAsSb/GaSb thermophotovoltaic (TPV) cells were monolithically interconnected in series to build open-circuit voltage V[sub oc]. GaInAsSb epitaxial layers were transferred to GaAs by wafer bonding with SiO[sub x]/Ti/Au, which provides electrical isolation of individual cells and forms an internal backsurface reflector. This configuration is compatible with monolithic series interconnection of TPV cells; can mitigate the requirements of filters used for front-surface spectral control; and has the potential to improve TPV device performance. Wafer-bonded GaInAsSb TPV cells exhibit nearly linear voltage building. At a short-circuit current density of 0.4 A/cm[sup 2], V[sub oc] of a single TPV cell is 0.2 V, compared to 0.37 and 1.8 V for 2- and 10-junction series-interconnected TPV cells, respectively. © 2003 American Institute of Physics. [ABSTRACT FROM AUTHOR]
- Subjects :
- PHOTOVOLTAIC cells
COMPLEX compounds
GALLIUM arsenide
Subjects
Details
- Language :
- English
- ISSN :
- 00036951
- Volume :
- 83
- Issue :
- 7
- Database :
- Complementary Index
- Journal :
- Applied Physics Letters
- Publication Type :
- Academic Journal
- Accession number :
- 10543263
- Full Text :
- https://doi.org/10.1063/1.1602165