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Electrical, Mechanical, and Hermetic Properties of Low-Temperature, Plasma Activated Direct Silicon Bonded Joints.

Authors :
Schjølberg-Henriksen, K.
Malik, N.
Gundersen, E. V.
Christiansen, O. R.
Imenes, K.
Fournel, F.
Moe, S.
Source :
ECS Journal of Solid State Science & Technology; 2015, Vol. 4 Issue 7, pP265-P271, 7p
Publication Year :
2015

Details

Language :
English
ISSN :
21628769
Volume :
4
Issue :
7
Database :
Complementary Index
Journal :
ECS Journal of Solid State Science & Technology
Publication Type :
Academic Journal
Accession number :
103528208
Full Text :
https://doi.org/10.1149/2.0271507jss