Characterization of on die capacitance and silicon measurement correlation.

Authors :: Quek, Li Chuang
Chai, Ming Dak
Shu, Heng Chuan
Source :: 2015 International Conference on Electronic Packaging & iMAPS All Asia Conference (ICEP-IAAC); 2015, p739-742, 4p
Publication Year :: 2015

Language :: English
ISBNs :: 9784904090138
Database :: Complementary Index
Journal :: 2015 International Conference on Electronic Packaging & iMAPS All Asia Conference (ICEP-IAAC)
Publication Type :: Conference
Accession number :: 103099159
Full Text :: https://doi.org/10.1109/ICEP-IAAC.2015.7111108