Flip-chip bonding of fine-pitch ultra-thin chips for SiF applications.

Authors :: Kusters, R. H. L.
Sridhar, A.
Cauwe, M.
van den Brand, J.
Source :: Proceedings of the 5th Electronics System-integration Technology Conference (ESTC); 2014, p1-5, 5p
Publication Year :: 2014

Language :: English
ISBNs :: 9781479940264
Database :: Complementary Index
Journal :: Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)
Publication Type :: Conference
Accession number :: 101234230
Full Text :: https://doi.org/10.1109/ESTC.2014.6962786