Investigating wire bonding pull testing and its calculation basics.

Authors :: Schmitz, S.
Kripfgans, J.
Schneider-Ramelow, M.
Muller, Wolfgang H.
Lang, K.-D.
Source :: Proceedings of the 5th Electronics System-integration Technology Conference (ESTC); 2014, p1-5, 5p
Publication Year :: 2014

Language :: English
ISBNs :: 9781479940264
Database :: Complementary Index
Journal :: Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)
Publication Type :: Conference
Accession number :: 101234210
Full Text :: https://doi.org/10.1109/ESTC.2014.6962766