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Parallel Thermal Analysis of 3-D Integrated Circuits With Liquid Cooling on CPU-GPU Platforms.
- Source :
- IEEE Transactions on Very Large Scale Integration (VLSI) Systems; Mar2015, Vol. 23 Issue 3, p575-579, 5p
- Publication Year :
- 2015
-
Abstract
- In this brief, we propose an efficient parallel finite difference-based thermal simulation algorithm for 3-D-integrated circuits (ICs) using generalized minimum residual method (GMRES) solver on CPU-graphic processing unit (GPU) platforms. First, the new method starts from basic physics-based heat equations to model 3-D-ICs with intertier liquid cooling microchannels and directly solves the resulting partial differential equations. Second, we develop a new parallel GPU-GMRES solver to compute the resulting thermal systems on a CPU-GPU platform. We also explore different preconditioners (implicit and explicit) and study their performances on thermal circuits and other types of matrices. Experimental results show the proposed GPU-GMRES solver can deliver orders of magnitudes speedup over the parallel LU-based solver and up to $4\times$ speedup over CPU-GMRES for both dc and transient thermal analyzes on a number of thermal circuits and other published problems. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 10638210
- Volume :
- 23
- Issue :
- 3
- Database :
- Complementary Index
- Journal :
- IEEE Transactions on Very Large Scale Integration (VLSI) Systems
- Publication Type :
- Academic Journal
- Accession number :
- 101110166
- Full Text :
- https://doi.org/10.1109/TVLSI.2014.2309617