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CHAPTER 3: Three-Dimensional Packaging in Multilayer Organic Substrates: 3.4: THREE-DIMENSIONAL PAPER-BASED MODULES FOR RFID/SENSING APPLICATIONS.
- Source :
- Three-Dimensional Integration & Modeling; 2007, p21-23, 3p
- Publication Year :
- 2007
Details
- Language :
- English
- ISBNs :
- 9781598292459
- Database :
- Complementary Index
- Journal :
- Three-Dimensional Integration & Modeling
- Publication Type :
- Book
- Accession number :
- 100668379
- Full Text :
- https://doi.org/10.2200/S00080ED1V01Y200710CEM017