Microstructural Evaluation and Linkage to the Engineering Properties of Metal-Ion-Contaminated Clay.

MLA

Chen, Yikun, et al. “Microstructural Evaluation and Linkage to the Engineering Properties of Metal-Ion-Contaminated Clay.” Materials (Basel, Switzerland), vol. 17, no. 21, Oct. 2024. EBSCOhost, https://doi.org/10.3390/ma17215320.

APA

Chen, Y., Chu, Y., Yan, C., Duan, W., & Han, A. (2024). Microstructural Evaluation and Linkage to the Engineering Properties of Metal-Ion-Contaminated Clay. Materials (Basel, Switzerland), 17(21). https://doi.org/10.3390/ma17215320

Chicago

Chen, Yikun, Ya Chu, Chao Yan, Wei Duan, and Aimin Han. 2024. “Microstructural Evaluation and Linkage to the Engineering Properties of Metal-Ion-Contaminated Clay.” Materials (Basel, Switzerland) 17 (21). doi:10.3390/ma17215320.