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Self-healing electrical bioadhesive interface for electrophysiology recording.

Authors :
Ma H
Hou J
Xiao X
Wan R
Ge G
Zheng W
Chen C
Cao J
Wang J
Liu C
Zhao Q
Zhang Z
Jiang P
Chen S
Xiong W
Xu J
Lu B
Source :
Journal of colloid and interface science [J Colloid Interface Sci] 2024 Jan 15; Vol. 654 (Pt A), pp. 639-648. Date of Electronic Publication: 2023 Oct 11.
Publication Year :
2024

Abstract

Electrical bioadhesive interfaces (EBIs) are standing out in various applications, including medical diagnostics, prosthetic devices, rehabilitation, and human-machine interactions. Nonetheless, crafting a reliable and advanced EBI with comprehensive properties spanning electrochemical, electrical, mechanical, and self-healing capabilities remains a formidable challenge. Herein, we develop a self-healing EBI by thoughtfully integrating conducting polymer nanofibers and a typical bioadhesive within a robust hydrogel matrix. The accomplished EBI demonstrates extraordinary adhesion (lap shear strength of 197 kPa), exceptional electrical conductivity (2.18 S m <superscript>-1</superscript> ), and outstanding self-healing performance. Taking advantage of these attributes, we integrated the EBI into flexible skin electrodes for surface electromyography (sEMG) signal recording from forearm muscles. The engineered skin electrodes exhibit robust adhesion to the skin even when sweating, rapid self-healing from damage, and seamless real-time signal recording with a higher signal-to-noise ratio (39 dB). Our EBI, along with its skin electrodes, offers a promising platform for tissue-device integration, health monitoring, and an array of bioelectronic applications.<br />Competing Interests: Declaration of Competing Interest The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.<br /> (Copyright © 2023 Elsevier Inc. All rights reserved.)

Details

Language :
English
ISSN :
1095-7103
Volume :
654
Issue :
Pt A
Database :
MEDLINE
Journal :
Journal of colloid and interface science
Publication Type :
Academic Journal
Accession number :
37864869
Full Text :
https://doi.org/10.1016/j.jcis.2023.09.190