Research Progress of Electroplated Nanotwinned Copper in Microelectronic Packaging.

MLA

Chen, Ke-Xin, et al. “Research Progress of Electroplated Nanotwinned Copper in Microelectronic Packaging.” Materials (Basel, Switzerland), vol. 16, no. 13, June 2023. EBSCOhost, https://doi.org/10.3390/ma16134614.

APA

Chen, K.-X., Gao, L.-Y., Li, Z., Sun, R., & Liu, Z.-Q. (2023). Research Progress of Electroplated Nanotwinned Copper in Microelectronic Packaging. Materials (Basel, Switzerland), 16(13). https://doi.org/10.3390/ma16134614

Chicago

Chen, Ke-Xin, Li-Yin Gao, Zhe Li, Rong Sun, and Zhi-Quan Liu. 2023. “Research Progress of Electroplated Nanotwinned Copper in Microelectronic Packaging.” Materials (Basel, Switzerland) 16 (13). doi:10.3390/ma16134614.