Mechanical Compatibility between Mg 3 (Sb,Bi) 2 and MgAgSb in Thermoelectric Modules.

Thermoelectric (TE) modules are exposed to temperature gradients and repeated thermal cycles during their operation; therefore, mechanically robust n- and p-type legs are required to ensure their structural integrity. The difference in the coefficients of thermal expansion (CTEs) of the two legs of a TE module can cause stress buildup and the deterioration of performance with frequent thermal cycles. Recently, n-type Mg ₃ Sb ₂ and p-type MgAgSb have become two promising components of low-temperature TE modules because of to their high TE performance, nontoxicity, and abundance. However, the CTEs of n-Mg ₃ Sb ₂ and p-MgAgSb differ by approximately 10%. Furthermore, the oxidation resistances of these materials at increased temperatures are unclear. This work manipulates the thermal expansion of Mg ₃ Sb ₂ by alloying it with Mg ₃ Bi ₂ . The addition of Bi to Mg ₃ Sb ₂ reduces the coefficient of linear thermal expansion from 22.6 × 10 ^-6 to 21.2 × 10 ^-6 K ^-1 for Mg ₃ Sb _1.5 Bi _0.5 , which is in excellent agreement with that of MgAgSb (21 × 10 ^-6 K ^-1 ). Furthermore, thermogravimetric data indicate that both Mg ₃ Sb _1.5 Bi _0.5 and MgAgSb are stable in air and Ar at temperatures below ∼570 K. The results suggest the compatibility and robustness of Mg ₃ Sb _1.5 Bi _0.5 and MgAgSb as a pair of thermoelectric legs for low-temperature TE modules.