Implementation of Flip-Chip Microbump Bonding between InP and SiC Substrates for Millimeter-Wave Applications.

MLA

Lee, Jongwon, et al. “Implementation of Flip-Chip Microbump Bonding between InP and SiC Substrates for Millimeter-Wave Applications.” Micromachines, vol. 13, no. 7, July 2022. EBSCOhost, https://doi.org/10.3390/mi13071072.

APA

Lee, J., Lee, J. Y., Song, J., Sim, G., Ko, H., & Kong, S. H. (2022). Implementation of Flip-Chip Microbump Bonding between InP and SiC Substrates for Millimeter-Wave Applications. Micromachines, 13(7). https://doi.org/10.3390/mi13071072

Chicago

Lee, Jongwon, Jae Yong Lee, Jonghyun Song, Gapseop Sim, Hyoungho Ko, and Seong Ho Kong. 2022. “Implementation of Flip-Chip Microbump Bonding between InP and SiC Substrates for Millimeter-Wave Applications.” Micromachines 13 (7). doi:10.3390/mi13071072.