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Realization of an Ultrahigh Power Factor and Enhanced Thermoelectric Performance in TiS 2 via Microstructural Texture Engineering.

Authors :
Gu Y
Song K
Hu X
Chen C
Pan L
Lu C
Shen X
Koumoto K
Wang Y
Source :
ACS applied materials & interfaces [ACS Appl Mater Interfaces] 2020 Sep 16; Vol. 12 (37), pp. 41687-41695. Date of Electronic Publication: 2020 Sep 01.
Publication Year :
2020

Abstract

Layered 1T-type TiS <subscript>2</subscript> powders were pretreated by an ethanol-based shear pulverization process, which showed outstanding effectiveness in reducing the average grain size and narrowing the size distribution while maintaining high crystallinity and plate-shaped morphology. The resulting bulk ceramics densified by spark plasma sintering possessed a highly (00 l )-oriented texture and pronounced anisotropy. They showed a noticeably increased σ and an unaffected S in the in-plane direction due to the increased carrier mobility μ and the constant carrier concentration n , which resulted in a significant enhancement of the in-plane power factor, optimally to an unprecedented high level of 1.6-1.8 mW m <superscript>-1</superscript> K <superscript>-2</superscript> in a range of 323-673 K. Meanwhile, the lattice thermal conductivity was reduced by approximately 20% due to the intensified grain boundary phonon scattering that overwhelmed the effect due to texturing. These effects not only demonstrated the powder shear pulverization pretreatment as a facial and reliable route toward a high-textured TiS <subscript>2</subscript> but also enabled a remarkable increase of ZT record for TiS <subscript>2</subscript> -based thermoelectrics (TEs) to approximately 0.7 at 673 K, indicating clearly the significant effect of texture engineering on TE performance.

Details

Language :
English
ISSN :
1944-8252
Volume :
12
Issue :
37
Database :
MEDLINE
Journal :
ACS applied materials & interfaces
Publication Type :
Academic Journal
Accession number :
32805870
Full Text :
https://doi.org/10.1021/acsami.0c09592