Mechanistic Insight into Bis(amino) Copper Formate Thermochemistry for Conductive Molecular Ink Design.

MLA

Shin, Homin, et al. “Mechanistic Insight into Bis(Amino) Copper Formate Thermochemistry for Conductive Molecular Ink Design.” ACS Applied Materials & Interfaces, vol. 12, no. 29, July 2020, pp. 33039–49. EBSCOhost, https://doi.org/10.1021/acsami.0c08645.

APA

Shin, H., Liu, X., Lacelle, T., MacDonell, R. J., Schuurman, M. S., Malenfant, P. R. L., & Paquet, C. (2020). Mechanistic Insight into Bis(amino) Copper Formate Thermochemistry for Conductive Molecular Ink Design. ACS Applied Materials & Interfaces, 12(29), 33039–33049. https://doi.org/10.1021/acsami.0c08645

Chicago

Shin, Homin, Xiangyang Liu, Thomas Lacelle, Ryan J MacDonell, Michael S Schuurman, Patrick R L Malenfant, and Chantal Paquet. 2020. “Mechanistic Insight into Bis(Amino) Copper Formate Thermochemistry for Conductive Molecular Ink Design.” ACS Applied Materials & Interfaces 12 (29): 33039–49. doi:10.1021/acsami.0c08645.