Back to Search
Start Over
Ectomycorrhizal fungal diversity and community structure associated with cork oak in different landscapes.
- Source :
-
Mycorrhiza [Mycorrhiza] 2018 May; Vol. 28 (4), pp. 357-368. Date of Electronic Publication: 2018 Apr 13. - Publication Year :
- 2018
-
Abstract
- Cork oak (Quercus suber L.) forests play an important ecological and economic role. Ectomycorrhizal fungi (ECMF) are key components for the sustainability and functioning of these ecosystems. The community structure and composition of ECMF associated with Q. suber in different landscapes of distinct Mediterranean bioclimate regions have not previously been compared. In this work, soil samples from cork oak forests residing in different bioclimates (arid, semi-arid, sub-humid, and humid) were collected and surveyed for ectomycorrhizal (ECM) root tips. A global analysis performed on 3565 ECM root tips revealed that the ECMF community is highly enriched in Russula, Tomentella, and Cenoccocum, which correspond to the ECMF genera that mainly contribute to community differences. The ECMF communities from the rainiest and the driest cork oak forests were distinct, with soils from the rainiest climates being more heterogeneous than those from the driest climates. The analyses of several abiotic factors on the ECMF communities revealed that bioclimate, precipitation, soil texture, and forest management strongly influenced ECMF structure. Shifts in ECMF with different hyphal exploration types were also detected among forests, with precipitation, forest system, and soil texture being the main drivers controlling their composition. Understanding the effects of environmental factors on the structuring of ECM communities could be the first step for promoting the sustainability of this threatened ecosystem.
Details
- Language :
- English
- ISSN :
- 1432-1890
- Volume :
- 28
- Issue :
- 4
- Database :
- MEDLINE
- Journal :
- Mycorrhiza
- Publication Type :
- Academic Journal
- Accession number :
- 29654367
- Full Text :
- https://doi.org/10.1007/s00572-018-0832-1