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Electroless Nickel Deposition for Front Side Metallization of Silicon Solar Cells.

Electroless Nickel Deposition for Front Side Metallization of Silicon Solar Cells.

Authors :
Hsieh SH
Hsieh JM
Chen WJ
Chuang CC
Source :
Materials (Basel, Switzerland) [Materials (Basel)] 2017 Aug 14; Vol. 10 (8). Date of Electronic Publication: 2017 Aug 14.
Publication Year :
2017

Abstract

In this work, nickel thin films were deposited on texture silicon by electroless plated deposition. The electroless-deposited Ni layers were characterized by scanning electron microscopy (SEM), transmission electron microscopy (TEM), energy dispersive x-ray spectroscopy (EDS), X-ray diffraction analysis (XRD), and sheet resistance measurement. The results indicate that the dominant phase was Ni₂Si and NiSi in samples annealed at 300-800 °C. Sheet resistance values were found to correlate well with the surface morphology obtained by SEM and the results of XRD diffraction. The Cu/Ni contact system was used to fabricate solar cells by using two different activating baths. The open circuit voltage (Voc) of the Cu/Ni samples, before and after annealing, was measured under air mass (AM) 1.5 conditions to determine solar cell properties. The results show that open circuit voltage of a solar cell can be enhanced when the activation solution incorporated hydrofluoric acid (HF). This is mainly attributed to the native silicon oxide layer that can be decreased and/or removed by HF with the corresponding reduction of series resistance.<br />Competing Interests: The authors declare no conflict of interest.

Details

Language :
English
ISSN :
1996-1944
Volume :
10
Issue :
8
Database :
MEDLINE
Journal :
Materials (Basel, Switzerland)
Publication Type :
Academic Journal
Accession number :
28805724
Full Text :
https://doi.org/10.3390/ma10080942