From Growth Surface to Device Interface: Preserving Metallic Fe under Monolayer Hexagonal Boron Nitride.

MLA

Caneva, Sabina, et al. “From Growth Surface to Device Interface: Preserving Metallic Fe under Monolayer Hexagonal Boron Nitride.” ACS Applied Materials & Interfaces, vol. 9, no. 35, Sept. 2017, pp. 29973–81. EBSCOhost, https://doi.org/10.1021/acsami.7b08717.

APA

Caneva, S., Martin, M.-B., D’Arsié, L., Aria, A. I., Sezen, H., Amati, M., Gregoratti, L., Sugime, H., Esconjauregui, S., Robertson, J., Hofmann, S., & Weatherup, R. S. (2017). From Growth Surface to Device Interface: Preserving Metallic Fe under Monolayer Hexagonal Boron Nitride. ACS Applied Materials & Interfaces, 9(35), 29973–29981. https://doi.org/10.1021/acsami.7b08717

Chicago

Caneva, Sabina, Marie-Blandine Martin, Lorenzo D’Arsié, Adrianus I Aria, Hikmet Sezen, Matteo Amati, Luca Gregoratti, et al. 2017. “From Growth Surface to Device Interface: Preserving Metallic Fe under Monolayer Hexagonal Boron Nitride.” ACS Applied Materials & Interfaces 9 (35): 29973–81. doi:10.1021/acsami.7b08717.