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Mapping interfacial excess in atom probe data.

Authors :
Felfer P
Scherrer B
Demeulemeester J
Vandervorst W
Cairney JM
Source :
Ultramicroscopy [Ultramicroscopy] 2015 Dec; Vol. 159 Pt 2, pp. 438-44. Date of Electronic Publication: 2015 Aug 22.
Publication Year :
2015

Abstract

Using modern wide-angle atom probes, it is possible to acquire atomic scale 3D data containing 1000 s of nm(2) of interfaces. It is therefore possible to probe the distribution of segregated species across these interfaces. Here, we present techniques that allow the production of models for interfacial excess (IE) mapping and discuss the underlying considerations and sampling statistics. We also show, how the same principles can be used to achieve thickness mapping of thin films. We demonstrate the effectiveness on example applications, including the analysis of segregation to a phase boundary in stainless steel, segregation to a metal-ceramic interface and the assessment of thickness variations of the gate oxide in a fin-FET.<br /> (Copyright © 2015 Elsevier B.V. All rights reserved.)

Details

Language :
English
ISSN :
1879-2723
Volume :
159 Pt 2
Database :
MEDLINE
Journal :
Ultramicroscopy
Publication Type :
Academic Journal
Accession number :
26346774
Full Text :
https://doi.org/10.1016/j.ultramic.2015.06.002