Thermal probe maskless lithography for 27.5 nm half-pitch Si technology.

MLA

Cheong, Lin Lee, et al. “Thermal Probe Maskless Lithography for 27.5 Nm Half-Pitch Si Technology.” Nano Letters, vol. 13, no. 9, Sept. 2013, pp. 4485–91. EBSCOhost, https://doi.org/10.1021/nl4024066.

APA

Cheong, L. L., Paul, P., Holzner, F., Despont, M., Coady, D. J., Hedrick, J. L., Allen, R., Knoll, A. W., & Duerig, U. (2013). Thermal probe maskless lithography for 27.5 nm half-pitch Si technology. Nano Letters, 13(9), 4485–4491. https://doi.org/10.1021/nl4024066

Chicago

Cheong, Lin Lee, Philip Paul, Felix Holzner, Michel Despont, Daniel J Coady, James L Hedrick, Robert Allen, Armin W Knoll, and Urs Duerig. 2013. “Thermal Probe Maskless Lithography for 27.5 Nm Half-Pitch Si Technology.” Nano Letters 13 (9): 4485–91. doi:10.1021/nl4024066.