Through-mask anodic patterning of copper surfaces and film stability in biological media.

Subjects

Subjects :

Buffers
Cell Adhesion
Electrochemistry
Escherichia coli cytology
Hydroxides chemistry
Models, Biological
Spectrum Analysis, Raman
Temperature
Copper chemistry

Details

Language :

English

ISSN :

0743-7463

Volume :

20

Issue :

8

Database :

MEDLINE

Journal :

Langmuir : the ACS journal of surfaces and colloids

Publication Type :

Academic Journal

Accession number :

15875886

Full Text :

https://doi.org/10.1021/la0350711