High hole mobility in p-strained Si grown on relaxed SiC virtual substrate by low-pressure chemical vapor deposition

The strained Si layer has been grown on the relaxed 3C–SiC virtual substrate by a hot-wall low-pressure chemical vapor deposition (LPCVD) system. The relaxed SiC virtual substrate was grown on Si(1 1 1) substrate by LPCVD and the crystal quality of the layer is characterized by X-ray diffraction and Fourier transform infrared absorption spectroscopy. It is apparent to find three regions in the Auger electron spectroscopy depth profile graph of the sample, which refer to the cap Si layer, the relaxed 3C–SiC virtual substrate and the Si(1 1 1) substrate, respectively. The bonding states of the relaxed 3C–SiC virtual substrate in the sample are analyzed by X-ray photoelectron spectroscopy. The Raman spectra of the sample indicate the cap Si layer is strained. A high hole Hall mobility value of 889 cm2/V s (300 K) is obtained in the strained Si layer, which is due to the in-plane compressive biaxial strain in this layer. [Copyright &y& Elsevier]