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Adaptive and Reliable Clock Distribution Design for 3-D Integrated Circuits.

Authors :
Chen, Xi
Zhu, Ting
Davis, William Rhett
Franzon, Paul D.
Source :
IEEE Transactions on Components, Packaging & Manufacturing Technology. Nov2014, Vol. 4 Issue 11, p1862-1870. 9p.
Publication Year :
2014

Abstract

In this paper, we present novel techniques to handle the complexity and challenges in clock distribution for 3-D integrated circuit. First, we propose a novel active deskew technique to adaptively mitigate the cross-tier variations and the 3-D wiring asymmetry. The new deskew technique neither relies on an accurate through-silicon-vias model nor an accurate reference clock distribution. Second, we design a phase-mixer-based tunable-delay-buffer (TDB), which can be linearly tuned in 360° and tolerant to process-voltage-termperature (PVT) variations. Third, based on the new deskew technique and TDB design, we propose an efficient clock distribution network topology, which can be realized without a need of balanced H-tree. Moreover, a thermal profile-based optimization flow is developed to further improve the power efficiency and reduce design overhead. A case study shows that the proposed techniques are able to largely improve the clock skews. The optimization flow is capable of reducing the design cost to achieve a better tradeoff of the skew performance and the design overhead. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
21563950
Volume :
4
Issue :
11
Database :
Academic Search Index
Journal :
IEEE Transactions on Components, Packaging & Manufacturing Technology
Publication Type :
Academic Journal
Accession number :
99234278
Full Text :
https://doi.org/10.1109/TCPMT.2014.2361356