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Preparation and reflow soldering characteristics of solder paste containing submicron Sn powders synthesised via chemical reduction.
- Source :
-
Research on Chemical Intermediates . Sep2014, Vol. 40 Issue 7, p2463-2470. 8p. - Publication Year :
- 2014
-
Abstract
- Sn nanoparticles (NPs) were synthesised via chemical reduction. Trisodium citrate dihydrate and mixtures of trisodium citrate dihydrate and 1,10-phenanthroline monohydrate were used as capping agents for the synthesis. When a specific amount of trisodium citrate dihydrate (3.4 × 10mM) was solely added, very fine particle sizes and excellent suppression of aggregation were achieved in the dried samples. When 5 mM of 1,10-phenanthroline monohydrate was used in combination with trisodium citrate dihydrate (at the optimum concentration of 3.4 × 10mM), the particle refining and the suppression of aggregation were further improved. The nano-solder paste prepared by mixing the synthesised Sn NPs with a commercial flux exhibited stable reflow soldering characteristics. The formation of an intermetallic layer, similar to that observed when commercial solder pastes containing micron-sized powders were used, was seen when soldering was carried out with the solder paste containing the synthesised Sn NPs. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 09226168
- Volume :
- 40
- Issue :
- 7
- Database :
- Academic Search Index
- Journal :
- Research on Chemical Intermediates
- Publication Type :
- Academic Journal
- Accession number :
- 97460173
- Full Text :
- https://doi.org/10.1007/s11164-014-1655-0