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Transient emission from microstrip interconnects: Theoretical formulation and CAD modeling.
- Source :
-
IEEE Transactions on Electromagnetic Compatibility . Aug96, Vol. 38 Issue 3, p367. 9p. 2 Black and White Photographs, 3 Diagrams, 3 Graphs. - Publication Year :
- 1996
-
Abstract
- Presents a hybrid technique in the analysis of transient emissions from microstrip interconnects. Background on microstrip technology; Derivation of space-time expression for traveling current pulse; Formation of planar structures; Current distributions.
- Subjects :
- *STRIP transmission lines
*ELECTROMAGNETIC pulses
Subjects
Details
- Language :
- English
- ISSN :
- 00189375
- Volume :
- 38
- Issue :
- 3
- Database :
- Academic Search Index
- Journal :
- IEEE Transactions on Electromagnetic Compatibility
- Publication Type :
- Academic Journal
- Accession number :
- 9701274865
- Full Text :
- https://doi.org/10.1109/15.536067