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Controlled electropolishing of copper foils at elevated temperature.

Authors :
Kwon, Gi Duk
Kim, Young Woo
Moyen, Eric
Keum, Dong Hoon
Lee, Young Hee
Baik, Seunghyun
Pribat, Didier
Source :
Applied Surface Science. Jul2014, Vol. 307, p731-735. 5p.
Publication Year :
2014

Abstract

Highlights: [•] Electrochemical polishing of copper foils at elevated temperature in H3PO4 electrolytes. [•] Copper foils electropolished at 65°C in 2.17M H3PO4 exhibited a lower surface roughness. [•] New prospects for the preparation of copper foils before the growth of high quality graphene layers. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
01694332
Volume :
307
Database :
Academic Search Index
Journal :
Applied Surface Science
Publication Type :
Academic Journal
Accession number :
96185832
Full Text :
https://doi.org/10.1016/j.apsusc.2014.04.144