Back to Search Start Over

Die attach materials and methods.

Authors :
Trigwell, Steve
Source :
Solid State Technology. Apr95, Vol. 38 Issue 4, p63. 4p. 1 Black and White Photograph, 3 Diagrams, 2 Charts, 1 Graph.
Publication Year :
1995

Abstract

Discusses various die attach materials and methods, and reviews die attach bonding mechanisms in manufacturing semiconductors. Failure mechanisms and reliability; Testing and characterization; Future trends.

Subjects

Subjects :
*BONDING of semiconductors

Details

Language :
English
ISSN :
0038111X
Volume :
38
Issue :
4
Database :
Academic Search Index
Journal :
Solid State Technology
Publication Type :
Academic Journal
Accession number :
9505023658

Tools

Authors Abstract Subjects Details