Post Copper CMP Hybrid Clean Process for Advanced BEOL Technology.

MLA

Tseng, Wei-Tsu, et al. “Post Copper CMP Hybrid Clean Process for Advanced BEOL Technology.” IEEE Transactions on Semiconductor Manufacturing, vol. 26, no. 4, Nov. 2013, pp. 493–99. EBSCOhost, https://doi.org/10.1109/TSM.2013.2273124.

APA

Tseng, W.-T., Devarapalli, V., Steffes, J., Ticknor, A., Khojasteh, M., Poloju, P., Goyette, C., Steber, D., Tai, L., Molis, S., Zaitz, M., Rill, E., Kennett, M., Economikos, L., Lustig, N., Bunke, C., Truong, C., Chudzik, M., & Grunow, S. (2013). Post Copper CMP Hybrid Clean Process for Advanced BEOL Technology. IEEE Transactions on Semiconductor Manufacturing, 26(4), 493–499. https://doi.org/10.1109/TSM.2013.2273124

Chicago

Tseng, Wei-Tsu, Vamsi Devarapalli, James Steffes, Adam Ticknor, Mahmoud Khojasteh, Praneetha Poloju, Colin Goyette, et al. 2013. “Post Copper CMP Hybrid Clean Process for Advanced BEOL Technology.” IEEE Transactions on Semiconductor Manufacturing 26 (4): 493–99. doi:10.1109/TSM.2013.2273124.