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SOI Substrate Removal for SEE Characterization: Techniques and Applications.
- Source :
-
IEEE Transactions on Nuclear Science . Apr2012 Part 2, Vol. 59 Issue 4, p1142-1148. 7p. - Publication Year :
- 2012
-
Abstract
- Techniques for removing the back substrate of SOI devices are described for both packaged devices and devices at the die level. The use of these techniques for microbeam, heavy-ion, and laser testing are illustrated. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 00189499
- Volume :
- 59
- Issue :
- 4
- Database :
- Academic Search Index
- Journal :
- IEEE Transactions on Nuclear Science
- Publication Type :
- Academic Journal
- Accession number :
- 84489185
- Full Text :
- https://doi.org/10.1109/TNS.2012.2189247