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Kinetics of electromigration-induced edge drift in Al-Cu thin-film interconnects.
- Source :
-
Journal of Applied Physics . 8/15/1997, Vol. 82 Issue 4, p1592. 7p. 1 Diagram, 1 Chart, 4 Graphs. - Publication Year :
- 1997
-
Abstract
- Studies the phenomenon of electromigration-induced edge drift in a finite, Al-Cu thin-film conductor using a one-dimensional diffusion model. Causes of edge drift; Grain boundaries; Electromigration diffusivity; Formation of precipitate-free zone at the cathode.
- Subjects :
- *THIN films
*ELECTRODIFFUSION
Subjects
Details
- Language :
- English
- ISSN :
- 00218979
- Volume :
- 82
- Issue :
- 4
- Database :
- Academic Search Index
- Journal :
- Journal of Applied Physics
- Publication Type :
- Academic Journal
- Accession number :
- 82957
- Full Text :
- https://doi.org/10.1063/1.365948